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Chapter
10
Thermal Stress Analysis
Analyzing practical problems sometimes requires
knowledge more than one engineering discipline. Thermal stress
problem is one of these problems that need the knowledge of heat
transfer and solid stress disciplines. Heat transfer analysis is
performed firstly to obtain temperature solution. The computed
temperature solution is then used as input data to determine the
deformation and thermal stresses of the solid. Examples of these
problems are automotive engines, electric motors, computer micro-
chips, as well as ceramic cups after pouring hot coffee into them.
We will study on how to analyze thermal stress
problems in this chapter. The chapter starts from presenting the
differential equations that govern heat transfer and equilibrium
equations in solids. Corresponding finite element equations are
derived for both analysis disciplines. ANSYS is then employed to
solve both academic and application problems. We will see that
the current finite element software can analyze interdisciplinary
problems, such as the thermal stress problem, effectively.