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Chapter


                                                                                       10








                                         Thermal Stress Analysis




                                            Analyzing  practical  problems  sometimes  requires
                                 knowledge more than one engineering discipline.  Thermal stress
                                 problem is one of these problems that need the knowledge of heat
                                 transfer  and  solid  stress  disciplines.    Heat  transfer  analysis  is
                                 performed  firstly  to  obtain  temperature  solution.    The  computed
                                 temperature  solution  is  then  used  as  input  data  to  determine  the
                                 deformation and thermal stresses of the solid.  Examples of these
                                 problems are automotive engines, electric motors, computer micro-
                                 chips, as well as ceramic cups after pouring hot coffee into them.
                                            We  will  study  on  how  to  analyze  thermal  stress
                                 problems  in  this  chapter.    The  chapter  starts  from  presenting  the
                                 differential  equations  that  govern  heat  transfer  and  equilibrium
                                 equations  in  solids.    Corresponding  finite  element  equations  are
                                 derived for both analysis disciplines.  ANSYS is then employed to
                                 solve both academic and application problems.  We will see that
                                 the  current  finite  element  software  can  analyze  interdisciplinary
                                 problems, such as the thermal stress problem, effectively.
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