Page 160 - Handbook of Adhesion Promoters
P. 160

8.11 Polydimethylsiloxane                                            153


            8.11 POLYDIMETHYLSILOXANE

            The following commercial additives are designed to be used for adhesion promotion of
            products containing silicone polymer: Chartwell C-545.1; Dynasylan 1146, 1122, 1124,
            AMMO, and DAMO; and Silquest A-1120 & A-2120 and VX-225.
                An  increase  in  adhesion  strength  after  oxygen  or  nitrogen  plasma  treatment  was
            attributed to the chemical interaction between functional groups introduced on the PDMS
                                                                      1
            surface  and  the  functional  groups  on  collagen  as  detected  by  FTIR.   The  high  peel
            strength  observed  on  PDMS  treated  with  argon  plasma  was  attributed  to  its  increased
                                                      1
            roughness which increased mechanical interlocking.
                                                                2
                Polydimethylsiloxane is frequently used in nanofabrication.  The two standard tech-
            niques are used for bonding of PDMS parts: surface activation by oxygen plasma and
            cocuring of PDMS parts with different ratios of components A and B (typical ratio is
                 2
            10:1).  The bond surface of the PDMS part and a substrate are treated with a weak oxygen
                                                                     2
            plasma, or these surfaces are activated using a corona discharge device.  The two surfaces
                                                        2
            are then brought into contact to form (Si–O–Si) bonds.  This technique is though limited
                                                               2
            to  silicon-based  substrates  such  as  glass,  silicon,  and  PDMS.   The  adhesion  promoter
                                                                  2
            (primer) GE SS4120 is recommended by General Electric Company.  This primer consists
                                                                      2
            of 5-10 wt% ethyl silicate, 30-60 wt% methanol, and 30-60 wt% ethanol.
                The  optimal  bonding  conditions  between  PDMS  and  copper-clad  printed  circuit
            boards can be attained when using a surface adhesion promoter and a surface treatment on
                           3
            copper-clad board.  The surface adhesion promoter was based on several components of
            Wacker Chemie silicone system and the surface treatment included etching with solution
                     3
            of Na S O .
                2 2
                    8
                Silicone  composition  exhibits  excellent  adherence  to  magnesium-based  substrates
                                                                      4
            such as magnesium alloys and excellent resistance to organic solvents.  These composi-
            tions  include  polymerizable  silicone  component,  amino-containing  silane  (e.g.,  amino-
            ethyl-3-aminopropyl-methyl-dimethylsilane) adhesion promoter which enhances adhesion
                                                     4
            of the composition to magnesium-based substrates.
                The base coat of the antifouling composition consists of an epoxy modified adhesion
                                                                           5
            promoter and the hydroxyl terminated polymer capable of reacting with silane.
            REFERENCES
            1  Juárez-Moreno, JA; Brito-Argáez, LG; Ávila-Ortega, A, Oliva, AI; Avilés, F; Cauich-Rodríguez, JV,
               Int. J. Adh. Adh., in press, 2017.
            2  Kersey, L; Ebacher, V; Bazargan, V; Wang, R; Stoeber, B, Lab. Chip, 9, 1002-4, 2009.
            3  Cai, D; Neyer, A; Sensors Actuators B: Chem., 160, 1, 777-83, 2011.
            4  Decato, AA, WO2001036537, Loctite Corporation, May 25, 2001.
            5  L  i  a  o  ,     W  P  ,     WO201412659, Momentive Performance Materials Inc., Aug. 21, 2014.
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