Page 75 - Handbook of Adhesion Promoters
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68                                     Substrates - Surface Condition and Treat-
















            Figure 4.15. Topography of the surface of poly(lactic acid) films (a) before and (b) after corona treatment.
            [Adapted, by permission, from Izdebska, J, Corona Treatment. Printing on Polymers, WilliamAndrew, 2016,
            pp. 123-42.]
                The  electric  discharge  machining  process  was  applied  for  Ti–6Al–4V  alloy  for
                                         37
            potential application in orthopedics.  The process induced the surface macro-roughness
                                          37
            and chemical changes to the surface.  The treated alloy provided better substrate for the
            adhesion  and  growth  of  human  bone-derived  cells  than  the  alloy  plasma-sprayed  with
                37
            TiO .  The electric discharge machining-treated Ti-6Al-4V alloy is a promising material
               2
            for the construction of bone implants, in particular implants which require firm and quick
            integration with the surrounding bone tissue, such as bone-anchoring parts of joint pros-
                 37
            theses.
            4.2.7 LASER
            The modifications induced on PET by an excimer laser irradiation performed below the
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            polymer ablation threshold improved the aluminum/PET adhesion.  Excimer laser at 193
                             38
            or 248 nm was used.  The treatments were carried out at atmospheric pressure in air,
                                              38
            under helium, or He-O  (5%) atmospheres.
                              2
                                                                               39
                Stainless steel was micro/nanostructured through femtosecond laser treatment.  The
                                                                               39
            process resulted in an increase in hydrophobicity and carbon content of the surface.  The
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            process increased in vitro bone formation rate.  A significant improvement in adhesion of
            human  endothelial  cells  and  human  bone  marrow  mesenchymal  stem  cells,  the  cells
            involved in microvessel and bone formation, respectively, and a significant decrease in
            fibroblast adhesion, which is implicated in osteolysis and aseptic loosening of prostheses
                                   39
            resulted from laser treatment.
                For surfaces irradiated by ArF laser below the ablation threshold, a high reduction in
            the number of the adhered platelets was observed; while their number increased in sam-
                                                        40
            ples treated at the fluence above the ablation threshold.  The change in platelet adhesion
                                                          40
            was attributed to the changes in chemistry and roughness.
                A high power diode laser was used to improve the wettability and adhesion charac-
                                    41
            teristics of ceramic materials.  The treatment resulted in a decrease of the contact angles
                             41
            of ceramic materials.
                An excimer laser treatment (193 or 248 nm) was adapted as a means to control the
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            adhesion of glass/epoxy and carbon/epoxy composites.  Figure 4.16 shows that the num-
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            ber of laser pulses increases surface roughness and polymer layer ablation.  The highest
            ablation mode is responsible for a fairly high roughness value (S =17.2 µm),  which is
                                                                  a
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            more than 20 times the value of the untreated sample.  At 1-3 pulses, only the surface
                         42
            cleaning occurs.  Above four pulses, the ablation takes place with the resulting chemical
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