Page 224 - Handbook of Adhesives and Sealants

Remarks Replacement(b) standard No void improperly made No void improperly made Replacement standard ... (c, d) (e) ... ... ... (e)

Coin tap test D ... ... D D D PD (e) D D PD ND
Immersion C-scan through transmission D ... ... D D PD(d) D D D ND ND ND

Ultrasonic inspection(b) Immersion C-scan Contact pulse shear pulse echo wave D ND ... ... ... ... D ND ND ND PD(d) ND D ND PD D D ND D ND ND ND ND

Contact through transmission D ... ... D D PD(d) D ND D D ND ND

NDE method(a) Contact 210 sonic pulse bond echo tester D D ... ... ... ... ND D ND ND ND ND PD ND ND D D D ND D ND PD(f) ND ND

Ultrasonic bond testers Harmonic bond tester Sondicator D D ... ... ... ... D ... ND ND PD(d) ND PD ND ND ND D D D D ND D ND ND (a) ND, not detected

Fokker bond tester D ... ... D ND PD(d) ND ND D D D ND
Neutron radiography D ... ... D D PD D D D D D D
Radiography
Low-kilovolt x-ray ND(b) ... ... ND D D(c) ND(e) ND(e) D D D ND(e) was x-ray opaque (FM 400). (f) Discloses defect at a very high sensitivity.

Honeycomb defects Void (adhesive to skin) .......... Void (adhesive to skin) repair with C-14....................... Void (adhesive to skin) repair with 9309.............

Continued 1. 2. 3. 4. 5. 6. 7. to adhesive) 8. 9. 10. 11. 12. 193