Page 419 - Handbook of Adhesives and Sealants

in Adhesive Formulations 3 use Max cure Complete life Pot temp, Cure F temp, conditions 75 F† at F 160 (75 F) days 7 min 30 70–275 160 (75 F) days 7 min
Resins Amount required* 11–13 10–12 6–8 12–14 26–30 1–4 80–100 11–13 30–70 30–70 30–70 equivalent of
Epoxy A–epichlorohydrin
with epoxide
Used Physical form Liquid Liquid Liquid Solid Solid Solid Liquid Liquid Semisolid Liquid Liquid
Agents resin with an bisphenol a

Curing .............. ............ ............... . . epoxy with batch; 190. concentration.

Characteristics of agent Curing Diethylenetriamine ................ Diethylaminopropylamine .......... dianiline monoethylamine anhydride............ Triethylamine.........

TABLE 10.8 Triethylenetetramine Metaphenylenediamine Methylene trifluoride Boron nadic Methyl Polyamides: value Amine value Amine value Amine 100 *Per hundred †