Page 154 - High Power Laser Handbook
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122   Diode Lasers                             Semiconductor Laser Diodes    123



                                                Laser diode

                                                           Emission
                                                                  Lens
                                                                          Attach



                 Submount

                                                                      Fiber output
                                             Fiber mount
                 Figure 5.20  Illustration of fiber-coupled single-emitter laser diode. Alternatively, the
                 chisel (or wedge) lens may be replaced by a separate fast-axis collimator (FAC)
                 mounted to the submount with a separate fiber output. The white stripe is ~100 mm
                 wide lasing aperture that nearly matches the fiber core diameter.










                  Submount                     Fiber-Coupled Package
                  Heat Sink       Housing         Wire Bond      Snout Seal
                  AlN             Steel frame, Cu   Au ball      Metal or glass
                  BeO             base            Ribbon         solder
                  CuW (15/85)     Kovar frame,                   Epoxy
                  CTE-matched     CuW base
                  composite       (20/80)
                                  Leads           Fiber Coupling  Strain Relief
                  Die-Bond Solder  Cu-core alloy  Chisel lens    Epoxy (at strip
                  AuSn (80/20)    Kovar           FAC + cleaved   region)
                                                  fiber          Urethane boot
                  Wire Bond       Component       Lens Attach    Lid
                  Au ball         Attach          Glass or metal   Steel or Kovar
                                  Metal solder    solder         Getter (optional)
                                  (< MP AuSn)     Epoxy
                                  (e.g., SAC,
                                  SnAg, BiSn)

                 Table 5.3  Summary of Key Components and Assembly Methods for Fabricating
                 Fiber-Coupled Packages. The Chip-On-Submount (Left) May Stand Alone or Become
                 a Component of the Fiber-Coupled Package
   149   150   151   152   153   154   155   156   157   158   159