Page 365 - High Power Laser Handbook
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334    So l i d - S t at e   La s e r s                                                                       Ultrafast Lasers in Thin-Disk Geometry    335


                      reveal that the main thermal impedance is determined by the heat sink
                      for pump spots larger than ~450 mm in diameter and pump power den-
                                          2 7,21
                      sities around 10 kW/cm .   Although this does not make it impossible
                      to further scale the pumped area, and thus the output power, the per-
                      formance will be affected by the temperature increase, and the loss in
                      efficiency will ultimately cancel the benefits of a larger size. However,
                      further scaling of the pump spot size is feasible using heat sink materi-
                      als with a better thermal conductivity, such as diamond.
                         As an example, we discuss the thermal management of the VEC-
                      SEL currently generating the highest CW power in the fundamental
                                    10
                      transverse mode  (Fig. 13.3). The structure’s GaAs wafer has been
                      removed, and mounted on a diamond heat sink. In Fig. 13.3a, the
                      output power is shown as a function of the pump power. Already at
                      a pump power of 30 W, an output power of 12.6 W is generated at
                      42  percent  total  optical-to-optical  efficiency.  The  maximum  output
                      power of 20 W is achieved for 50 W of pump radiation at 40 percent
                      efficiency. At 30 W pump power, the incident pump power density is
                      16.6  kW/cm²;  at  50  W,  it  is  27.6  kW/cm².  Figure  13.3b  shows  the
                      calculated temperature difference between the maximum tempera-
                      ture in the gain region and that of the heat sink using a standard
                      finite-element simulation. The temperature increase as a function of
                      the pump mode radius is given for the two discussed pump intensi-
                      ties (27.6 kW/cm²: solid gray line; 16.6 kW/cm²: dashed gray line).
                      The  vertical  line  indicates  the  240-mm  pump  radius  used  in  the
                      experiment. At the highest pump intensity, we obtain a temperature
                      increase of 40 K for the 240-mm pump radius. A comparison with an
                      unprocessed gain structure on a 600-mm thick GaAs wafer shows the
                      importance of thermal management for power scaling (black curve).


                                                 100
                   20                      50     80    Gain structure
                                                        on GaAs
                  Output power (W)  15     30 Opt.-to-opt. efficiency (%)  ∆T (K)  60  Gain structure  ~4×
                                           40
                                                        on diamond
                   10
                                                  40
                                           20
                    5
                                          10      20
                    0                      0       0
                     0  10  20  30  40  50         10       10       10       10
                         Incident pump power (W)           Mode radius on gain (µm)
                               (a)                               (b)
                 Figure 13.3  (a) Output power of the currently highest fundamental mode continuous-
                 wave VECSEL versus the incident pump power. The mode radius is 240 µm, and the
                 gain structure is mounted on a diamond head spreader. (b) Finite-element simulation
                 of the heating of the gain structure versus the mode radius on the gain at a fixed
                 pump and heating intensity. The dashed lines correspond to an incident pump power
                 density of 16.6 kW/cm , or 30 W of incident pump power in (a); the solid lines
                                  2
                 correspond to 27.6 kW/cm , or 50 W of incident pump power. 10,24
                                     2
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