Page 211 - High Temperature Solid Oxide Fuel Cells Fundamentals, Design and Applications
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18 8  High Temperature Solid Oxide Fuel Cells: Fundamentals, Design and Applications


           Contact  materials  are used  in stack  assembly for  better  electrical  contact
         between  the interconnect  and  the  electrodes  and  also  for  compensation  of
         dimensional tolerances of  the parts. Such contact layers have no direct role in
         electrochemical reactions, but they can provide a homogeneous contact over the
         whole area of  the fuel cell and minimise the ohmic losses within the stack. The
         maximum assembling temperature depends on the interconnect material used.
         For SOPCs with only ceramic components [83, 841, the bond between the cell
         and the LaCr03 interconnect is realised by sintering at about 1300°C and a solid,
         stiff bond with good electrical contact is obtained requiring no other contact
         material. In the case of Cr 5Fe 1Y203 interconnects, sintering can be utilised for
         stack assembly providing good contact without any contact material due to the
         high  melting  point  (1700°C) of  the  alloy  [38].  However,  with  ferritic  steel
         interconnects,  the stack  assembly temperature  cannot be  higher  than 900-
         950°C due to enhanced corrosion and thus contact material is needed for good
         electrical contact.
           Since there are no electrochemical requirements for the contact materials,
         they can be different from the electrode materials and be selected on the basis of
         their electrical conductivity and thermal expansion. Lanthanum cobaltites have
         high  specific conductivities,  up  to  1700 S/cm  [81]. However,  the  thermal
         expansion  of  these  cobaltites  has  a  large  mismatch  with  the  other  cell
         components  as  mentioned  previously.  For  these  ceramic  contact  materials,
         therefore,  a  compromise  between  acceptable  conductivity  and  tolerable
         mismatch in thermal expansion is generally required.
           A  chemical interaction between  the contact layer  and an electrode or the
         interconnect should not  occur, but cannot be  avoided in most  cases due to
         the  reaction  of  the  contact  material  with  the  chromia  scale formed on  the
         interconnect.  In  all cases where  alkaline earth-containing  chromite contact
         materials were used, the formation of chromates was observed [57, 64, 68, 85,
         8  61 leading to progressive decomposition of  the perovsltite material. The change
         in contact resistance (Figure 7.7) is not only due to the scale formation on the
         surface of  the interconnect but also driven by the reaction between the oxide
         scale and the volatile Cr species with the contact material, by the formation of
         alkaline earth chromates and the steady depletion of  material  at the contact
         material/interconnect interface  due to the volatility  of  these chromates.  The
         latter  process  was  demonstrated  by  Hou  et  al.  [87]  by  applying  different
         cathode  materials  - (i)  Pt,  (ii)  Lao.~Sro.4C003, (iii)  Lao.ssSro.lsMn03  +
                                   -
         La0.~Sro.~Gao.8~SMg0.1703 onto  an  un-oxidised  Fe-based  alloy  with
         composition similar to X18 CrN 28. They found that the area-specific resistance
         of  the cobaltite specimen increased  at a  greater rate than for the other two
         material  combinations  although  the  cobaltite  is  more  conductive  than  the
         manganite/gallate mixture. For the contact material, it is important to have not
         only an initial low contact resistance but also a constant resistance with time (or
         even a decreasing resistance as shown in Figure 7.7).
           Often the  corrosion  of the interconnect  on the anode side is not  an issue
         because Ni meshes are used  and these make good electrical contact with the
         interconnect.  However, the Ni  wires can also be corrosively attacked during
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