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lnterconnects  18 7


           7.4 Protective Coatings and Contact Materials for Metallic
           Alnterconnects

           The metallic interconnects have two main disadvantages. The first is the release
           of volatile Cr species. In atmospheres containing water vapour, the most volatile
           specie is chromium  acid, H2Cr('I)04  [37, 741, which is transported  with  the
           oxidant gas through the cathode to the cathode/electrolyte interface, competes
           with the oxygen molecules for the electrochemically active sites and blocks them
           with Cr("')  [74]. This results in an increase in cathode polarisation  [75, 761.
           After  the  initial  blocking  of the  electrochemically  active  sites,  the  ongoing
           transport  and  reduction  of  chromium  species lead  to  decomposition of  the
           cathode perovskite material and the formation of spinels [76,77]. The chromium
           transport in the cathode compartment needs to be minimised to overcome these
           problems, either by using 'Cr getter' materials like La203 [3 51 in the cathode or
           by  applying protective coatings of  lanthanum chromites  [64, 651, lanthanum
           manganites [47] or yttrium manganites [66] to the interconnect (Table 7.5). The
           thermally sprayed manganite coatings have led to stable long-term performance
           lasting about 12,000 h with a degradation rate in cell voltage of  less than 1%/
           1000 h [78].
             Matsuzalti  and  Yasuda  reported  that  Lao.6Sro.4Feo.8Coo.z03 cathodes  are
           much  more  stable  against  Cr  poisoning  than  Lao.&o.l  5Mn03  or
           Pro.6Sro.4Mn03 cathodes [ 791, especially when ceria-based solid electrolytes are
           used, and no enrichment of chromium was found at the Lao.6Sro.4Feo.sCoo.203/
           ceria  interface  (after  10 h).  A  possible  explanation  might  be  the  different
           overvoltages of the cathodes for oxygen and H2Cr(V1)04 reduction. While for the
           manganites the reduction of  the chromium oxyhydroxide is the energetically
           preferred  reaction,  in  the  presence  of  the  ferrites  the  reduction  of  oxygen
           appears  to  require  less  activation  energy.  Although  the  exposure  times
           were  short in their  experiments,  modification of  cathodes  may be  a possible
           alternative to avoid Cr poisoning and the use of protective coatings. The extent
           of  Cr  evaporation  from  steels  or  other  alloys  and  the  effectiveness  of
           protective  coatings  can be  estimated  before  stack  assembly  by  transpiration
           experiments  [ 74,801.  Such  investigations  are  useful  in  new  interconnect
           material  development  and  also  for  an  understanding  of  the  cell  and  stack
           degradation rates.
             The second major disadvantage of  metallic interconnects is the formation of
           oxide scales leading to significant ohmic losses. The interaction of  the metallic
           interconnect with the adjacent ceramic cell components and the resulting time-
           dependent resistance of these material combinations is highly important. In the
           case of Cr  5Fe 1Y203, the best contact material for the cathode was found to be
           ]LaCo03 [64] before protective layers of  (La,Sr)Cr03 were  applied to  avoid Cr
           evaporation. LaCo03 was also successfully used in combination with ferritic steel
           1491, although  the  thermal  expansion  coefficient of  the  cobaltite  is  higher
           [64,81] than the other SOFC materials [82]. Besides the lower contact resistance
           (Figure 7.7), LaCo03 appears to react with the released chromium species to form
           a La(Co,Cr)03 perovskite and therefore retains the Cr vapour.
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