Page 364 - Introduction to Information Optics
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References 349
REFERENCES
6.1 See, for example, many papers in The Critical Review in Optoelectronic Interconnects and
Packaging, Ray Chen and Pete Guilfoyle, Eds., 1996, Vol. CR-62.
6.2 D P. Seraphim and D. E. Barr, 1990, "Interconnect and Packaging Technology in the 90's."
Proc. SPIE, Vol. 2. 1390, pp. 39-54.
6.3 • Neugerbauer, R. O. Carlson, R. A. Pillion, and T. R. Haller, "Multichip Module Designs
for High-Performance Applications," in Multichip Modules, Compendium of 1989 Papers, pp.
149 163, International Electronic Packaging Society, •, 1989.
6.4 Steve Heath, Chapter 3, VMEbus User's Handbook, CRC Press, Inc., Florida, 1989.
6.5 Robert Haveman, "Scaling and Integration Challenges for Cu/low k Dielectrics," workshop
on processing for ULSI: transistors to interconnects, April 22, 1999, Austin Texas.
6.6 M. R. Feldman, 1990, "Holographic Optical Interconnects for Multichip Modules," Proceed-
ings SPIE, vol. 1390, pp. 427-433.
6.7 Michael Feldman, Iwona Turlik, and G. M. Adema, "Microelectronic Module Having
Optical and Electrical Interconnects," US Patent, No. 5638469, 1997.
6.8 D. Plant, B. R. Robertson, H. S. Hinton, G. C. Boisset, N. H. Kim, Y. S. Liu, M. R. Otazo.
D. R. Rolston, A. Z. Shang, and W. M. Robertson, 1995, "MicroChannel-Based Optical
Backplane Demonstrators Using FET-SEED Smart Pixel Array," Proceedings of SPIE, Vol.
2400, pp. 170-174, Canada, June 22-24, 1997.
6.9 C. Tocci and J. Caufield, Optical Interconnects, Foundation and Applications, Artech House,
Boston, 1994.
6.10 Scott Hinton, 1993, "Progress in Systems Based on Free Space Optical Interconnection,"
SPIE Vol. 1849, pp. 2-3.
6.11 David Plant, B. Robertson, and Scott Hinton, "Optical, Optomechanical, and Optoelectronic
Design and Operational Testing of a Multistage Optical Backplane Demonstration System."
IEEE Third International Conference on Massively Parallel Processing Using Optical
Interconnections, Maui, Hawaii, 1996.
6.12 Ray T. Chen, Suning Tang, T. Jannson, and J. Jannson, 1993, "A 45-cm-long Compression-
Molded Polymer-Based Optical Bus," Appl. Phys. Lett. vol. 63, pp. 1032 1034.
6.13 Linghui Wu, Feiming Li, Suning Tang, Bipin Bihari, and Ray T. Chen, 1997, "Compression-
Molded Three-Dimensional Tapered Polymeric Waveguides for Low-Loss Optoelectronic
Packaging" IEEE Photon. Technol. Lett., Vol. 9, No. 12, pp. 1601-1603.
6.14 Suning Tang, Ting Li, F. Li, Michael Dubinovsky, Randy Wickman, and Ray T. Chen, 1996,
"Board-Level Optical Clock Signal Distribution Based on Guided-Wave Optical Intercon-
nects in Conjunction with Waveguide Hologram," Proc. SPIE, vol. 2891, pp. 111117.
6.15 Linghui Wu, Feiming Li, Suning Tang, Bipin Bihari, and Ray T. Chen, 1997, "Compression-
Molded Three-Dimensional Tapered Polymeric Waveguides for Low-Loss Optoelectronic
Packaging," IEEE Photonics Technol. Lett., vol. 9, no. 12, pp. 1601-1603.
6.16 Toshiaki Suhara and Hiroshi Nishihara, 1996, "Integrated Optics Components and Devices
Using Periodic Structures," IEEE J. of Quantum Electronics, vol. QE-22, no. 6, pp. 845-867.
6.17 D. Brundrett, E. Glystis, and T. Gaylord, 1994, "Homogeneous Layer Models for High-
Spatial-Frequency Dielectric Surface-Relief Gratings," Appl. Opt., vol. 33, no. 13, pp. 2695-
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6.18 D. Y. Kim, S. K. Tripathy, Lian Li, and J. Kumar, 1995, "Laser-Induced Holographic
Surface-Relief Gratings on Nonlinear Optical Polymer Films," Appl. Phys. Lett., vol. 66, no.
10, pp. 1166-1168.
6.19 Ray T. Chen, Feiming Li, Micheal Dubinovsky, and Oleg Ershov, 1996, "Si-Based Surface-
Relief Polygonal Gratings for 1-to-many Wafer-Scale Optical Clock Signal Distribution,"
IEEE Photonics Technol. Lett., vol. 8, no. 8.