Page 345 - System on Package_ Miniaturization of the Entire System

Radio Fr equency System-on-Package (RF SOP) 319

specific integrated passive devices using wafer level packaging technologies,” 2005,
pp. 1594–1601.
86. P. M. Raj, K. Coulter, J. H. Hwang, I. R. Abothu, S. Wellinghoff, M. Iyer, and R.
Tummala, “A low temperature process to integrate high K-low loss pyrochlore
films in organic substrates for thin film RF capacitors,” IMAPS Advanced Technology
Workshop on Integrated/Embedded Passives, San Jose, CA, November 15–16, 2007.
87. L. Wang, R. M. Xu, and B. Yan, “MIM capacitor simple scalable model determina-
tion for MMIC application on GAAS,” Progress in Electromagnetics Research, PIER 66,
2006, pp. 173–78.
88. A. G. Cockbain and P. J. Harrop, “The temperature coefficient of capacitance,” Brit.
J. Appl. Phys., ser. 2, vol. 1, 1968, pp. 1109–15.
89. J. H. Hwang, P. M. Raj, I. R. Abothu, C. Yoon, M. Iyer, H. M. Jung, J. K. Hong,
and R. Tummala, “Organic-based RF capacitors with ceramic-like properties,” 57th
Electronic Components and Technology Conference, Reno, NV, May 29–June 1, 2007.
90. D. C. Thompson, J. Papapolymerou, and M. M. Tentzeris, “High temperature dielec-
tric stability of liquid crystal polymer at mm-wave frequencies,” IEEE Microwave
and Wireless Components Letters, vol. 15, issue 9, 2005, pp. 561–63.
91. R. K. Ulrich and L. W. Schaper, Integrated Passive Component Technology, Wiley-
Interscience, IEEE Press, NJ, 2003, p. 80.
92. R. Kambe, R. Imai, T. Takada, M. Arakawa, and M. Kuroda, “MCM substrate with
high capacitance,” Proc. 1994 International Conference on Multichip Modules, Denver,
CO, April 13–15, 1994, pp. 136–41.
93. R. Ulrich, L. Schaper, D. Nelms, and M. Leftwich, “Comparison of paraelectric and
ferroelectric materials for applications as dielectrics in thin film integrated capaci-
tors,” International Journal of Microcircuits and Electronic Packaging, vol. 23, no. 2, 2000,
pp. 172–80.
94. B. Piernas, K. Nishikawa, K. Kamogawa, T. Nakagawa, and K. Araki, “High-Q factor
three-dimensional inductors,” IEEE Transactions on Microwave Theory and Techniques,
vol. 50, issue 8, August 2002, pp. 1942–49.
95. L. Zu, Lu Yicheng, R. C. Frye, M. Y. Lau, S.-C. S. Chen, D. P. Kossives, Lin Jenshan,
and K. L. Tai, “High Q-factor inductors integrated on MCM Si substrates,” IEEE
Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced
Packaging [see also IEEE Transactions on Components, Hybrids, and Manufacturing
Technology], vol. 19, issue 3, August 1996, pp. 635–43.