Page 18 - Sami Franssila Introduction to Microfabrication
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Preface xvii



           ADVICE TO STUDENTS                          inaccurate) as answers culled from Internet. It should be
                                                       borne in mind that even constants are often not well
           This book is an introductory text. Basic university  known: for instance, recent measurements of silicon
           physics and chemistry suffices for background. Materials  melting point have resulted in values 1408 C by one
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           science and electronics courses will of course make  group, 1410 C by one, 1412 C by seven groups, 1413 C
           many aspects easier to understand, but the structure of  by eight groups and 1416 C by three groups, and if
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           the book does not necessitate them. The book contains  older works are encountered, values range from 1396 C
           250 homework problems, and in line with the idea  to 1444 C. With thin film materials properties are
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           of microfabrication as an independent discipline, they  very much deposition process dependent, and different
           are about fabrication processes and microstructures; not  workers have measured widely different values for such
           about devices. Problems fall mainly in three categories:  basic properties as resistivity or thermal conductivity.
           process design/analysis, simulations and back-of-the-  Even larger differences will pop up, if, for instance,
           envelope calculations. The problems that are designed to  the phase of metal film changes from body-centered
           be solved with a simulator are marked by “S”. A simple  cubic to β-phase: temperature coefficient of resistivity
           one-dimensional simulator will do. The “ordinary”  can then be off by a factor of ten. Polymeric materials,
           problems are designed to develop a feeling for orders  too, exhibit large variation in properties and processing.
           of magnitude in the microworld: linewidths, resistances,  There are also calculations of economic aspects of
           film thicknesses, deposition rates, stresses etc. It is  microfabrication: wafer cost, chip size and yield. A bit
           often enough to understand if a process can be done in  of memory costs next to nothing, but the fabs (fab is
           seconds, minutes or hours; or whether resistance range  short for fabrication facility) that churn out these chip
           is milliohms, ohms or kiloohms. You must learn to make  are enormously expensive.
           simplifying assumptions, and to live with uncertain  Comments and hints to selected homework problems
           data. Searching the Internet for answers is no substitute  are given in Appendix A. In Appendix B you can find
           to simple calculations that can be done in minutes  useful physical constants, silicon material properties and
           because the simple estimates are often as accurate (or  unit conversion factors.
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