Page 13 - Sami Franssila Introduction to Microfabrication

xii Contents

32.5 PECVD 327
32.6 Residence time 327
32.7 Exercises 327
References and related readings 327

33 Tools for CVD and Epitaxy 329
33.1 CVD rate modelling 329
33.2 CVD reactors 330
33.3 ALD (Atomic Layer Deposition) 331
33.4 MOCVD 332
33.5 Silicon CVD epitaxy 333
33.6 Epitaxial reactors 334
33.7 Exercises 335
References and related readings 336

34 Integrated Processing 337
34.1 Ambient control 337
34.2 Dry cleaning 338
34.3 Integrated tools 339
34.4 Exercises 339
References and related readings 339

PART VII: MANUFACTURING 341

35 Cleanrooms 343
35.1 Cleanroom standards 343
35.2 Cleanroom subsystems 345
35.3 Environment, safety and health (ESH) aspects 346
35.4 Exercises 348
References and related readings 348

36 Yield 349
36.1 Yield models 349
36.2 Process step effect 352
36.3 Yield ramping 352
36.4 Exercises 352
References and related readings 352

37 Wafer Fab 355
37.1 Historical development of IC manufacturing 356
37.2 Manufacturing challenges 357
37.3 Cycle time 357
37.4 Cost-of-ownership (CoO) 358
37.5 Cost of processed silicon 359
37.6 Exercises 360
References and related readings 360