Page 12 - Sami Franssila Introduction to Microfabrication

Contents xi

27 Multilevel Metallization 277
27.1 Two-level metallization 277
27.2 Multilevel metallization 278
27.3 Damascene metallization 280
27.4 Metallization scaling 280
27.5 Copper metallization 281
27.6 Low-k dielectrics 282
27.7 Exercises 284
References and related readings 285

28 MEMS Process Integration 287
28.1 Double-side processing 287
28.2 Membrane structures 291
28.3 Through-wafer structures 293
28.4 Patterning over severe topography 294
28.5 DRIE versus anisotropic wet etching 295
28.6 IC–MEMS integration 296
28.7 Exercises 298
References and related readings 298

29 Processing on Non-silicon Substrates 301
29.1 Substrates 301
29.2 Thin-film transistors, TFTs 302
29.3 Exercises 304
References and related readings 304

PART VI: TOOLS 307

30 Tools for Microfabrication 309
30.1 Batch processing versus single-wafer processing 309
30.2 Equipment figures of merit 310
30.3 Tool life cycles 311
30.4 Process regimes: temperature–pressure 311
30.5 Simulation of process equipment 312
30.6 Measuring fabrication processes 312
30.7 Exercises 314
References and related readings 314
31 Tools for Hot Processes 315
31.1 High temperature equipment: hot wall versus cold wall 315
31.2 Furnace processes 315
31.3 Rapid-thermal processing/rapid-thermal annealing 316
31.4 Exercises 319
References and related readings 319

32 Vacuum and Plasmas 321
32.1 Vacuum-film interactions 321
32.2 Vacuum production 322
32.3 Plasma etching 324
32.4 Sputtering 325