Page 11 - MEMS Mechanical Sensors

x Preface

offered by a selection of packages. Chapter 4 describes some of the techniques and
structures that can be used to package micromachined mechanical sensors. It also
discusses ways to minimize unwanted interactions between the device and its
packaging. Chapter 5 presents some of the fundamental principles of mechanical
transduction. This chapter is largely intended for readers who might not have a
background in mechanical engineering. The remaining four chapters of the book are
dedicated to describing specific mechanical microengineered devices including pres-
sure sensors (Chapter 6), force and torque sensors (Chapter 7), inertial sensors
(Chapter 8), and flow sensors (Chapter 9). These devices use many of the principles
and techniques described in the earlier stages of the book.

Acknowledgments

We authors express our thanks to all the contributing authors of this book. They are
all either present or former colleagues with whom we have worked on a variety of
MEMS projects over the past decade or so.

Steve Beeby
Graham Ensell
Michael Kraft
Neil White
Southampton, United Kingdom
April 2004