Page 7 - MEMS Mechanical Sensors

vi Contents

CHAPTER 4
Mechanical Sensor Packaging 57
4.1 Introduction 57
4.2 Standard IC Packages 58
4.2.1 Ceramic Packages 58
4.2.2 Plastic Packages 59
4.2.3 Metal Packages 59
4.3 Packaging Processes 59
4.3.1 Electrical Interconnects 60
4.3.2 Methods of Die Attachment 63
4.3.3 Sealing Techniques 65
4.4 MEMS Mechanical Sensor Packaging 66
4.4.1 Protection of the Sensor from Environmental Effects 67
4.4.2 Protecting the Environment from the Sensor 71
4.4.3 Mechanical Isolation of Sensor Chips 71
4.5 Conclusions 80
References 81

CHAPTER 5
Mechanical Transduction Techniques 85
5.1 Piezoresistivity 85
5.2 Piezoelectricity 89
5.3 Capacitive Techniques 92
5.4 Optical Techniques 94
5.4.1 Intensity 94
5.4.2 Phase 95
5.4.3 Wavelength 96
5.4.4 Spatial Position 96
5.4.5 Frequency 96
5.4.6 Polarization 97
5.5 Resonant Techniques 97
5.5.1 Vibration Excitation and Detection Mechanisms 98
5.5.2 Resonator Design Characteristics 99
5.6 Actuation Techniques 104
5.6.1 Electrostatic 104
5.6.2 Piezoelectric 107
5.6.3 Thermal 107
5.6.4 Magnetic 109
5.7 Smart Sensors 109
References 112

CHAPTER 6
Pressure Sensors 113
6.1 Introduction 113
6.2 Physics of Pressure Sensing 114
6.2.1 Pressure Sensor Specifications 117
6.2.2 Dynamic Pressure Sensing 120