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13 Handling and
Contamination Control
Considerations for Critical
Space Applications
Philip T. Chen and R. David Gerke
CONTENTS
13.1 Introduction................................................................................................ 289
13.2 Wafer Handling ......................................................................................... 290
13.3 Handling during Die Singulation, Release, and Packaging...................... 291
13.3.1 Die Singulation............................................................................. 291
13.3.2 Handling during Release .............................................................. 291
13.3.3 Packaging...................................................................................... 292
13.4 In-Process Handling and Storage Requirements....................................... 293
13.5 Electrostatic Discharge Control ................................................................ 294
13.6 Contamination Control .............................................................................. 295
13.6.1 Contamination Control Program .................................................. 295
13.6.2 MEMS Contamination Control .................................................... 296
13.6.3 Contamination Controls during Fabrication................................. 298
13.6.4 MEMS Package Contamination Control...................................... 298
13.6.5 MEMS Postpackage Contamination Control............................... 301
13.6.6 Contamination Control on Space Technology 5.......................... 303
13.7 Conclusion ................................................................................................. 306
References............................................................................................................. 306
13.1 INTRODUCTION
No characteristic of microelectromechanical systems (MEMS) devices sets them
apart from integrated circuits (ICs) more clearly than their sensitivity to surface
contamination. An IC wafer leaves the foundry passivated for normal environmen-
tal exposure; a MEMS wafer does not. As a result, standard back-end processing
steps (dicing, pick and place, die attach, wire bonding or bumping, and packaging)
commonly used for ICs cannot be used for MEMS.
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© 2006 by Taylor & Francis Group, LLC
