Page 291 - MEMS and Microstructures in Aerospace Applications

Osiander / MEMS and microstructures in Aerospace applications DK3181_c012 Final Proof page 283 1.9.2005 9:13pm

MEMS Packaging for Space Applications 283

FIGURE 12.8 ST5 — VEC-MEMS shutter array (MSA) radiator. (From JHU/APL.)

printed circuit board with rad hard amplifier array electronics, power supply, and
3
chassis and occupies a volume of approximately 200 cm in a 0.5 kg, 300 mW
package. The sensor head, fabricated and assembled at the wafer-level and stacked
in a planar geometry, consists of an array of five identical spectrometer modules,
each with a different fixed field-of-view consisting of a collimator, electrostatic
analyzer, energy selector masks, microchannel plates (MCP), and anode plate for
detection. 13
The region of the sensor head comprising the collimator, electrostatic analyzer,
and energy selector masks consists of three layers of silicon and two layers of

© 2006 by Taylor & Francis Group, LLC