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128                     6 MECHANICS IN HARDWARE DESCRIPTION LANGUAGES


               true for very simple structures. Thus Chau and Wise [67] and Bota et al. [41], for
               example, use analytical equations for the modelling of the square membrane of a
               pressure sensor. In addition to bending mechanics, torsional mechanics can also be
               considered analytically, as G´ omez-Cama et al. [122], for example, demonstrate for
               a capacitive acceleration sensor and Wetsel and Strozewski [428] demonstrate for a
               micromirror.
                 To illustrate analytical modelling, the example of a capacitive pressure sensor,
               see Figure 6.12, will be considered again in what follows. The bending of the upper
               plate can be described by the following equation, see Timoshenko and Woinowski-
               Krieger [401] or Voßk¨ amper et al. [417]:

                                      1                          E   t 3 p
                                u =    (p + p el ),  where D =                   (6.50)
                                                                    2
                                      D                        1 − ν 12
               where   represents the Laplace operator, u the vertical deflection, D the bending
               resistance, p the external pressure and p el an electrostatic pressure caused by the
               read-out voltage applied through the plates. The bending resistance is again defined
               as shown via the modulus of elasticity E, Poisson’s ratio ν and the thickness of the
               plate t p . The electrostatic pressure can be described as follows using the radius:

                                          1               U      	 2
                                   p el (r) =  ε 0 ε r,eff (r)                   (6.51)
                                          2          t c + t i − u(r)
               with the dielectric constants ε 0 and ε r,eff , the radius r, the read-out voltage U, the
               thickness of the hollow space t c and the insulator thickness t i . A direct execution
               of the four-fold integration of (6.50) for the solution with respect to deflection is
               not possible because the electrostatic pressure in (6.51) is itself dependent upon
               the deflection. A polynomial approximation of p el solves the problem, see [417]:

                                                     n
                                                         i
                                            p el (r) ≈  a i r                    (6.52)
                                                    i=0

               The general solution of equation (6.50) is then calculated as:
                                1 p     1         r    	    1            r
                                                                2
                                    4
                           u =     r + C 1 r 2  ln  − 1 + C 2 r + C 3 ln
                               64 D     4        R 0        4           R 0
                                       n
                                               a i      i+4

                               + C 4 +                 r                         (6.53)
                                               2
                                         (i + 2) (i + 4) 2
                                      i=0
               with the radius of the plate R 0 and four constants C 1 to C 4 that have been yielded
               by the integration, the values of which are to be determined from the boundary
               conditions. With the aid of the resulting equation, further effects can be built in,
               such as the restriction of the plate movement through the insulator, the influence
               of plate suspension, or the dynamics of the movement.
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