Page 377 - A Practical Guide from Design Planning to Manufacturing
P. 377

Silicon Debug and Test  347

        infrared is used to monitor individual transistors as well as taking photos
        of the whole die. An infrared laser focused on one transistor will be partially
        reflected and the amount it is reflected depends upon the voltage at the tran-
        sistor. This allows the monitoring of the voltage within each cycle as the
        transistor switches. This process is called laser voltage probing (LVP). 10
          Shmoo plots, IREM images, and LVP waveforms all provide additional
        information along with the output of DFT circuits, but in the end it is the
        ingenuity and reasoning of the debug engineers, which create a theory as
        to the cause of a bug. More measurements may be taken to test this theory,
        and ultimately a fix is proposed. Possible solutions to a silicon bug are listed
        as follows:

          Full-layer stepping
          Metal-only stepping
          Change fuse settings
          Microcode patch
          BIOS update
          OS update
          Document as errata

          Many bugs can be fixed only by changing the processor design. Each
        revision of the design is called a stepping, and very few processors are
        ever sold on their first stepping. Typically about half of the mask layers
        required for fabrication are used to create the transistors and about half
        are used to create the interconnect. If the transistors and interconnect
        must be changed, this is a full-layer stepping. Money and time are saved
        if a design change affects only the interconnects and allows the same
        transistor level masks to be used. This is called a metal-only stepping.
        In either case, updated circuit schematics must be created and new
        layout drawn. The new layout is converted to masks, and the new design
        is fabricated. This whole process can take weeks or months, making it
        extremely important that the change actually fixes the bug and does
        not create new ones. One way to make sure of this is through focused
        ion beam (FIB) edits. 11
          A proposed design change may be implemented in hardware by phys-
        ically altering the die. AFIB machine can cut through wires, disable tran-
        sistors, or even trigger the deposition of new wires. FIB edits cannot
        create transistors, but in anticipation of this problem some designs will




          10
           Yee, “Laser Voltage Probe (LVP).”
          11
           Livengood and Donna, “Design For (Physical) Debug.”
   372   373   374   375   376   377   378   379   380   381   382