Page 104 - Power Electronics Handbook

Smartpower 97

Bonding tool Film track
/

lado
chip

Die carrier

Carrier movement
Figure 3.17 Film carrier bonding: (a) leads positioned for bond, (b) bonding operation,
(c) bonded chip lifted off carrier, (d) next chip and leads in position

3.16 References
Clarke, P. (1991) Discrete ways to get smart, Power; Special Report, 25 July, pp. 20-21.
Doane, D.A. and Franzon, P.D. (1994) The case for multichip modules, Semiconductor
International, April, pp. 85-86.
Fhherty, J.M. (1993) New SMDs are leading us on, Test and Measurement World, January, pp.
51-54.
Iscoff, R. (1993) Will hybrid circuits survive? Semiconductor International, October, pp.
56-59.
Iscoff, R. (1995) Has the packaging revolution finally run out of steam? Semiconductor
International, February, pp. 67-72.
Lall, P. and Bahagath, S. (1993) An overview of multichip modules, Solid State Technology,
September, pp. 65-76.
Losch, K. et al. (1993) Advanced assembly methods: multichip modules and flipchip
technology, Electrical Communication, 3rd Quarter, pp. 260-267.