Page 103 - Power Electronics Handbook
P. 103
96 Power semiconductor control components
(C)
IC
lead frame
(e )
IC Epoxy resin
Y
Chip-dy
Wire
bond
Butt style
lead frame
(f)
Figwe 3.16 Surface-mounted IC packages: (kb) SOIC, (c.d) PLCC sectioned, (e) PLCC sectioned, (f)
butt style sectioned.
