Page 105 - Power Electronics Handbook
P. 105
98 Power semiconductor control components
Malinak, D. (196) Poweraevice packaging beats the heat, Electronic Design, September 16, pp.
41-50.
Murari, B. et al. (1995) Smart Power ICs, Springer.
Rubenstein, R. (1996) Smart! Electronics Weekly, Technology Supplement, March, pp. 29-30.
Sergent, J.E. and Harper, C.A. (1995) Hybrid Micmlectronics Handbook, McGraw-Hill.
Sherwani, N. et al. (1995) Introduction to Multichip Modules, John Wiley.
Taker, S.C. and Sekulic. Z. (1994) Adopting multichip module technology, Electronic Design,
27 June, pp. 153-160.
Westwater, A. (1994) Packaging projections, What’s New in Electronics, November, pp.
7-10.
Wilson, R. (1995) Power behind surface mount, Electronics Weekly, 24 May, pp. 35-37.