Page 13 - Six Sigma for electronics design and manufacturing

Contents
xii
7.2.1
experiment
Types of DoE experiments using
7.2.2
215
orthogonal arrays
7.2.3
Two-level orthogonal arrays
217
220
7.2.4
Three-level orthogonal arrays
7.2.5
221
Interaction and linear graphs
7.2.6
225
Multilevel arrangements and combination
designs
The Taguchi contribution to DoE
7.2.7 Steps in conducting a successful DoE 211
227
7.3 The DoE Analysis Tool Set 227
7.3.1 Orthogonal array L9 saturated design 228
example: Bonding process optimization
7.3.2 Graphical analysis conclusions 231
7.3.3 Analysis of DoE data with interactions: 232
Electrical hipot test L8 partial factorial
Resolution IV example
7.3.4 Statistical analysis of DoEs 234
7.3.5 Statistical analysis of the hipot experiment 236
7.4 Variability Reduction Using DoE 238
7.5 Using DoE Methods in Six Sigma Design and 240
Manufacturing Projects
7.6 Conclusions 241
7.7 References and Bibliography 241
Chapter 8. Six Sigma and Its Use in the Analysis of Design 243
and Manufacturing for Current and New
Products and Processes
8.1 Current Product Six Sigma Strategy 244
8.1.1 Process improvement in current products 246
8.2 Transitioning New Product Development to 250
Six Sigma
8.2.1 Design analysis for six sigma 251
8.2.2 Measuring the capability of current 253
manufacturing processes
8.2.3 Investigating more capable processes for 255
new products
8.2.4 Case studies of process capability 256
investigations for manufacturing: Stencil
technology for DoE
8.3 Determining Six Sigma Quality in Different Design 260
Disciplines
8.3.1 Mechanical product design process 260