Page 27 - Six Sigma for electronics design and manufacturing

Preface
xxvi
ing adopt it as its goal, a very daunting task, especially if current
products were not designed with six sigma in mind.
The approach I use in this book is not to be rigid about six sigma. I
have attempted to present many of the options available to measure
and implement six sigma, and not to specifically recommend a course
of action in each instance. Engineers are very creative people, and
they will always try to meld new concepts into ones familiar to them.
Many will put their own stamp on its methodology or add their own
way of doing things to the six sigma techniques. The one sure way to
make them resist a new concept is to force it down their throats. I be-
lieve these individual engineers’ efforts should be encouraged, as long
as they do not detract from the overall goal of achieving six sigma.
I hope that this book will be of value to the neophyte as well as the
experienced practitioners of Six Sigma. In particular, it will benefit
the small to medium size companies that do not have the support staff
and the resources necessary to try out some of the six sigma ideas and
techniques and meld them into the company culture. The experiences
documented here should be helpful to encourage many companies to
venture out and develop new world-class products through six sigma
that can help them grow and prosper for the future.
Acknowledgments
The principals of six sigma discussed in this book were learned, col-
lected and practiced through 14 years on the faculty of the University
of Massachusetts, Lowell, where working as a teacher, researcher,
and consultant to different companies increased my personal knowl-
edge and experience in the fields of design, manufacturing, quality,
and six sigma.
I am indebted to several organizations for supporting and encourag-
ing me during the lengthy time needed to collect my materials, write
the chapters, and edit the book. I thank The University of Massachu-
setts, Lowell for its continuing support for product design and manu-
facturing, especially Chancellor Bill Hogan; the Dean of the James B.
Francis College of Engineering, Krishna Vedula; and the chairman of
the Department of Mechanical Engineering, John McKelliget. The
Reed Exhibition Companies and SMTA, through their NEPCON and
SMTI conferences in Anaheim and Chicago, encourage and nurture
the design and manufacturing of electronic products.
In addition, I offer my thanks to Mr. Steve Chapman of McGraw-
Hill, Inc., who was my editor for this book, as well as my previous two
books on concurrent engineering. He always believed in me and en-
couraged and guided me through three books, and for that I am very
grateful.