Page 24 - Six Sigma for electronics design and manufacturing

Abbreviations
AQAP
Analysis of variance
ANOVA
Appraiser variation
AV Advance product quality planning and control plan
BIST Built in self-test
BOM Bill of materials
CAD Computer-aided design
CAE Computer-aided engineering
CAM Computer-aided manufacturing
CEM Contract electronic manufacturers
CLT Central limit theory
CIM Computer-integrated manufacturing
CPI Continuous process improvement
Cp Capability of the process
Cpk Capability of the process, with average shift
CR Criteria rating
DA Decision analysis
DFD Data flow diagrams
DFM Design for manufacture
DFT Design for testability
DoE Design of experiments
DOF Degrees of freedom
DPMO Defect per million opportunities
DPU Defects per unit
ECO Engineering change orders
ERP Enterprise requirements planning
ESI Early supplier involvement
EV Equipment variation
IPC Institute for Interconnecting and Packaging of Electronic Circuits
FMEA Failure mode effect analysis
FT Functional test
FTY First-time yield
GMP Good manufacturing practices
GR&R Gauge repeatability and reproducibility
Hipot High potential
IC Integrated circuit
ICT In-circuit test
JIT Just in time
MR Moving range
MTBF Mean time between failure
NIH Not invented here

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