Page 19 - Six Sigma for electronics design and manufacturing

Illustrations and Tables
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Figure 4.3
IC assembly line Cpk example.
118
Figure 4.4
PCB test alternatives.
Figure 4.5
121
Figure 5.1
135
t distribution with standard normal distribution.
166
t distribution with significance .
Figure 5.2
Confidence interval around the mean and is known.
Figure 5.3
141
distribution with significance .
2
143
Figure 5.4
Obtaining confidence limits from distribution with
144
Figure 5.5
confidence (1 – )%.
155
Sources of process variation and error.
Figure 5.6
Accuracy and precision target example.
Figure 5.7 DPMO chart example. 2 115
156
Figure 5.8 Summation of averages and standard deviations. 157
Figure 5.9 Distributions of prototype and early production of parts. 166
Figure 6.1 Product life cycle stages. 171
Figure 6.2 Typical cost distribution of an electronic product. 176
Figure 6.3 Cost history of an electronic product based on the 177
concept stage.
Figure 6.4 Volume sensitivity of the cost of an electronic product. 178
Figure 6.5 Electronic design implementation in PCBs. 183
Figure 6.6 PCB fabrication steps. 185
Figure 6.7 A typical approach to printed circuit board (PCB) assembly. 194
Figure 7.1 Basic elements of DoE. 206
Figure 7.2 Possible effects of different factors. 209
Figure 7.3 The use of an L8 as full factorial versus saturated design. 219
Figure 7.4 The plot of interactions of the example in Table 7.6. 222
Figure 7.5 Linear graphs for the interactions of L8 shown in Table 7.7. 223
Figure 7.6 Bonding process DoE graphical analysis. 231
Figure 7.7 Hipot design DoE graphical analysis. 234
Figure 7.8 Visualizing the error of the hipot experiment. 238
Figure 8.1 Progression of quality tools for existing products. 245
Figure 8.2 Cause and effect diagram for mixed technology PCBs. 248
Figure 8.3 Graphical analysis of DoE for mixed technology soldering of 248
PCBs.
Figure 8.4 Histogram of solder defects distribution 6 months before 250
and after DoE.
Figure 8.5 Overall new product quality, including design and 251
manufacturing.
Figure 8.6 Design six sigma example—bandpass filter. 252
Figure 8.7 Tolerance analysis example, three square parts. 264
Figure 8.8 Mechanical design of a typical vibrating angioplasty probe. 267
Figure 8.9 S/N analysis for fine pitch SMT processing variability. 276
Figure 8.10 Printer qaulity DoE test pattern. 278
Figure 8.11 Prodcut test strategy. 284
Figure 9.1 Concurrent engineering culture. 288
Figure 9.2 Life cycle models for different products. 292
Figure 9.3 Traditional versus concurrent engineering project 294
communications.
Figure 9.4 Core competencies chart and outsource matrix. 299