Page 44 - Six Sigma for electronics design and manufacturing
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The Nature of Six Sigma and Its Connectivity to Other Quality Tools
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                        raised to a higher value, noted symbolically in the figure in units of
                        weight (lbs.).
                         A  QFD  example  for  improving  the  quality  of  a  manufacturing
                        process is shown in Figure 1.4. In this case, the PCB assembly, con-
                        sisting of surface mount technology (SMT) solder processes, was an-
                        alyzed.  The  QFD  team  used  the  QFD  process  to  identify  customer
                        needs for quality and delivery of PCBs and rank their importance, as
                        well as the process characteristics of various elements in SMT man-
                        ufacturing,  such  as  process  steps  and  suppliers  of  PCBs.  The  cus-
                        tomers of PCB assembly were the personnel in the next stage of pro-
                        duction: final product assembly and test technicians. The output of
                        the QFD chart indicates which process element was the most impor-
                        tant in meeting customer needs. This is the element that the team
                        should focus on to reduce process defects or manufacturing variabil-
                        ity. In the example given in Figure 1.4, the relationship matrix and
                        their  calculations  for  the  weighted  requirements  are  outlined.  It
                        shows that the team should work most effectively on improving the
                        quality of the screening process before all others, to increase internal
                        customer satisfaction. Indeed, the team decided to run a DoE to op-
                        timize the process, similar to the DoE example 8.2.4, given in Chap-
                        ter 8.
                         The customer needs were identified in a survey of the appropriate
                        customers that use the PCBs, which are the output of the manufac-
                        turing process, divided into primary and secondary needs. The cus-
                        tomers also indicated their ratings of importance for each need. This
                        rating is qualitative and is ranked by the team using a scale of 1 to 5,
                        with the larger number being the most important. The process engi-
                        neers also identified the PCB assembly process characteristics. The
                        team  then  generated  the  relationship  matrix  by  matching  the  cus-
                        tomer  needs  to  the  process  characteristics,  in  terms  of  four  levels
                        (strong, medium, weak, and none). There should at least one match
                        for each item in the matrix. If an item from the customer needs is not
                        matched by at least one item in the quality characteristics, then the
                        team has to reevaluate the QFD analysis. This is true of the opposite
                        case of a process characteristic not matched by a least one customer
                        need.
                         The results of the analysis, or the weighted requirements, are de-
                        termined  by  multiplying  the  importance  factor  by  the  relationship
                        strength. The screening operation achieved the highest score, indicat-
                        ing that customer needs are best satisfied when that process is im-
                        proved before the others. This chart represents the analysis by the
                        QFD team at that moment in time, and their collective findings; it
                        does not necessarily reflect a universal solution to improving an SMT
                        process.
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