Page 32 - Wire Bonding in Microelectronics

The Technical Intr oduction to the Thir d Edition 11

FIGURE 1-7 An unusual application of ball bonding that forms an electrical
connection between conductors in two different planes. In this case, the
ultrasonic energy (tool motion) is parallel to the length of the component.
Both bonding surfaces were Au plated (over Ni/Cu). The ball (wire) is Au,
1% Pd. Creative (oriented to angle the package) clamping was also
necessary to hold the unit in place. (Reprinted with permission from
Hutchinson Technology, Hutchinson, MN, USA.)

References
1-1 Wesselmann, C., “Flip Chip off the Dime,” an editorial in Advanced Packaging,
V-5 (March/April 1996), p. 7.
1-2 Schafft, H. A., Modified from Testing and Fabrication of Wire-Bond Electrical
Connections—A Comprehensive Survey, National Bureau of Standards (NIST)
Tech. Note 726 (September 1972), pp. 1–129.
1-3 Ultrasonic Welding, In: Welding Handbook, 9th Ed, Vol 3, Welding Processes,
Part 2, Miami: American Welding Society, 2007. ISBN 0-978-87171-053-6.
1-4 Jaszczuk, W, ter Brake, H. J. M., et. al., “Bonding of a Niobium Wire to a Niobium
Thin Film”, Measurement Science and Technology, v-2 (1991), pp. 1121–1122.
1-5 Any chemical handbook or the Handbook of Chemistry and Physics (CRC
Press) contains such tables.
1-6 Houk, G. D., private communication Hutchinson Technology, Hutchinson,
Minnesota.