Page 8 - Wire Bonding in Microelectronics
P. 8

Co n t e n t s    vii


                          4.2.4  Effect of Metallurgy and Bonding
                                Processes on the Bond
                                Pull Force   . . . . . . . . . . . . . . . . . . . . . . .    86
                          4.2.5  Effect of Wire Elongation on Bond Pull
                                Force (Primarily for Large-Diameter
                                Al, but also for Au Wire Used in Ball
                                Bonding)[4-9]    . . . . . . . . . . . . . . . . . . .    88
                     4.3  Ball-Bond Shear Test   . . . . . . . . . . . . . . . . . . . . .    92
                          4.3.1  Introduction   . . . . . . . . . . . . . . . . . . . . .    92
                          4.3.2  Apparatus   . . . . . . . . . . . . . . . . . . . . . . .    93
                          4.3.3  A Manual Shear Probe As an Aid in
                                Setting Up Ball Bonder (For
                                Laboratory Use)    . . . . . . . . . . . . . . . . .    95
                          4.3.4  Interferences to Making Accurate
                                Ball-Shear Test Measurements   . . . . .    97
                          4.3.5  Ball-Shear Force versus Bonded
                                Area   . . . . . . . . . . . . . . . . . . . . . . . . . . . .   101
                          4.3.6  Effect of Gold-Aluminum
                                Intermetallics on the
                                Shear Force   . . . . . . . . . . . . . . . . . . . . . .   107
                          4.3.7  Pluck Test, Pry Test, Flip Test, etc.
                                (Failure Analysis Technique)   . . . . . . .   107
                          4.3.8  Comparison of the Ball-Shear and the
                                Bond-Pull Tests   . . . . . . . . . . . . . . . . . .   109
                          4.3.9  Applications of the Ball-Shear
                                Test   . . . . . . . . . . . . . . . . . . . . . . . . . . . .   109
                         4.3.10  Shear Test for Wedge Bonds   . . . . . . .   112
                         4.3.11  Ball-Shear Test Standardization   . . . .   115
                     4.4  Evaluating Both the Ball and the Wedge Bond
                         on a Single Wire   . . . . . . . . . . . . . . . . . . . . . . . . .   116
                     4.5  Thermal Stress Test for Au-Al Wire Bond
                         Reliability   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   116
                     4.6  Future Issues in Wire Bond Testing   . . . . . . . .   117
                     Appendix 4A  Typical Failure Modes of the
                         Ball-Shear Test (Failure Mode 2 Is the
                         Normal Desired Test Result)   . . . . . . . . . . . . . .   118
                     Appendix 4B  The Nondestructive Bond
                         Pull Test   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   120
                          4B.1  Introduction   . . . . . . . . . . . . . . . . . . . . .   120
                          4B.2  Metallurgical and Statistical
                                Interpretation of the NDP Test   . . . . .   121
                          4B.3  Assessment of Any NDP Test-Induced
                                Metallurgical Defects   . . . . . . . . . . . . .   123
                          4B.4  Limitations of the NDP Test    . . . . . . .   124
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