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224  A ComPRehenSIVe GuIDe To SolAR eneRGy SySTemS



             as a p-type dopant has been most successful contacting technique and as a result the most
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             widespread, reaching hole densities of 10  cm . however, due to the fast-diffusing nature
             of copper in CdTe this has also been widely demonstrated to lead to long-term stability
             issues. A heat treatment is often required for copper to form the desired Cu 2 Te complexes
             but this can aid migration of copper atoms from the back-contact toward the main junc-
             tion along grain boundaries, resulting in shunting pathways that reduce long-term per-
             formance. upon reaching the main junction, copper can dope the CdS layer, increasing
             its resistivity, and is known to contribute defect states that aid recombination and lower
             performance [56]. This is not solely a problem at the point of contact fabrication as nu-
             merous studies have shown Cu-contacted devices to be less stable even under standard
             operating conditions. Additional layers placed between the CdTe and metal contact have
             also been used to reduce the contact resistance by choosing an appropriate material that
             forms an ohmic contact to each adjacent layer. ZnTe has demonstrated the effectiveness
             of this method [57] and is now used in commercial modules due to its similar lattice pa-
             rameter and favorable band positions. When doped with copper it forms a pseudo-ohmic
             contact; however, doping densities must be kept low to avoid excessive copper migration
             but the overall stability of the contact is improved. other interface layers that have been
             studied that could achieve higher doping densities while remaining stable include Sb 2 Te 3
             [58], FeS 2  [59,60], moo 3  [61], niP [62], and As 2 Te 3  [63], which have shown an ability to form
             ohmic contacts to varying degrees. The current state of the art when it comes to contact-
             ing is now a copper doped layer of either ZnTe or Te coupled to an aluminum contact. This
             apparently gives sufficient ohmic contact coupled to stability suitable enough for module
             production where a 20+ year lifespan is essential.

             10.2.6  General CdTe Solar Cell Production Notes

             There are numerous subtleties to CdTe solar cell fabrication that, while useful to know, are
             never reported in journal articles as they are not particularly novel or exciting. They are
             however essential to producing working solar cells, this section is intended to give a brief
             selection of useful tips for fabrication intended to help CdTe solar cell novices.
             -  It is preferable to use a commercial TCo-coated glass, in particular FTo as this is
                stable to all but the most extreme of deposition processes. ITo may be applicable for
                some processes but for others it will break down.
             -  Deposit CdS at a thickness of >200 nm. This will be thick enough, irrespective of
                deposition technique to ensure good coverage. Some optical losses will result but the
                thickness can be reduced in subsequent depositions.
             -  The thickness of the CdTe required will depend on the deposition method used.
                For techniques such as sputtering, buried junctions (i.e., depletion region located
                away from the CdS interface) may occur for thicknesses much greater than1.5 µm so
                layers will need to be ∼1 µm. For higher temperature deposition techniques due to
                the increased grain size thicker films may be required to ensure good coverage of the
                substrate and thus minimize shunting.
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