Page 220 - A Comprehensive Guide to Solar Energy Systems
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Chapter 10 • CdTe Solar Cells  223







































                 FIGURE 10.7  (A) Two-diode equivalent circuit model for a CdTe solar cell, (B) band diagram of two noninteracting
                 diodes in the light at zero bias, (C) The effect of barrier height on the current–voltage characteristics (simulated), and
                 (D) reduction of fill-factor with increase in barrier height [53].

                 lowering  the  back-contact  barrier,  the  back-contact  barrier  dominates  and  current
                 through the solar cell is limited, appearing as a flattening of the current voltage curve at
                 high forward bias (V > V oC ). This can result in lowering fill factor values with increased
                 barrier height (Fig. 10.7D).
                   Significant research has been undertaken to develop a way to form an ohmic contact
                 between CdTe and a suitable metal. one such a way to overcome this challenge is to  allow
                 charge to tunnel through the Schottky barrier by heavily doping the CdTe layer at the back
                                              +
                 surface so that it is effectively “p ”, forming a pseudo-ohmic contact. This is not as simple
                 as one might anticipate as achieving such high doping densities in CdTe is tricky because
                 Fermi level pinning and self-compensation act against the introduction of acceptors in
                 high concentrations. A fairly common technique is to modify the interface between CdTe
                 and the metal by chemically etching the surface of CdTe to modify the surface.  nitric
                 phosphoric acid [54] and bromine methanol solutions [55] are routinely used as etchants
                 to preferentially remove Cd atoms at the back surface of CdTe before contacting, leaving
                 behind a tellurium rich layer which has greater p-type character as a result of cadmium
                 vacancies. however, excessive etching can cause pinholes in the CdTe film, which act as
                 shunting pathways  lowering performance. The introduction of copper at the back-contact
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