Page 280 - An Introduction to Microelectromechanical Systems Engineering

Summary 259

Selected Bibliography

Electronic Packaging & Interconnection Handbook, 2nd ed., C. A. Harper (ed.), New
York: McGraw-Hill, 1997.
Harper, C. A., and M. B. Miller, Electronic Packaging, Microelectronics and Interconnec-
tion Dictionary, New York: McGraw Hill, 1993.
Kececioglu, D., Reliability Engineering Handbook, Vols. 1 and 2, Englewood Cliffs, NJ:
Prentice Hall, 1991.
Lau, J. H., et al., Electronic Packaging: Design, Materials, Process, and Reliability, New
York: McGraw-Hill, 1998.
Manzione, L. T., Plastic Packaging of Microelectronic Devices, New York: Van Nostrand
Reinhold, 1990.
Striny, K. M., “Assembly Techniques and Packaging of VLSI Devices,” in VLSI Technol-
ogy, 2nd ed., S. M. Sze (ed.), New York: McGraw-Hill, 1988, pp. 566–611.