Page 255 - Design for Environment A Guide to Sustainable Product Development

Electr onic Equipment Industries 231

year energy savings compared to PCs without power management
en abled. The device is shipped in 100% recyclable packaging with
more paper and less plastic foam for easier reuse, and the machine
itself uses 55% less metal and 37% less plastic than standard PCs and
monitors.
HP has also emphasized recycling of electronic products and
operates recycling programs in more than 40 locations around the
world. The programs seek to reduce the environmental impact of
products, minimize waste going to landfills, and help customers
conveniently manage products at their end-of-life in an environmen-
tally sound fashion. In 2006 alone, HP recovered 187 million pounds
of electronics globally, 73% more than IBM, its closest competitor. By
2010, HP is aiming to reach a cumulative total of 2 billion pounds of
recycled electronics and print cartridges. Plastics and metals recov-
ered from products recycled by HP have been used to make a range
of new products, including auto body parts, clothes hangers, plastic
toys, fence posts, serving trays, and roof tiles. In addition to recy-
cling, HP offers a variety of product end-of-life management services
including donation, trade-in, asset recovery, and leasing.

Greening the Data Center
The rapid growth of enterprise computing has led to the establish-
ment of sophisticated data centers housing hundreds of servers and
consuming significant amounts of energy for both powering and
cooling. HP has responded with Thermal Logic, a technology designed
to reduce power and cooling costs and increase data center capacity.
The technology actively and automatically monitors and adapts power
load and cooling capacity based on changes in demand and environ-
ment, via innovations that ensure the highest energy efficiency, redun-
dancy, and scalability of power and cooling.
HP’s new ProLiant blade server products were designed to use
25% less energy per watt, saving more than 700 watts per server
enclosure, as well as a new BladeSystem enclosure that boosts the
energy efficiency of server rack power supplies. By using a multi-
zone architecture and multiple thermal sensors in each enclosure,
Thermal Logic captures and analyzes power and temperature through-
out the entire system and distributes power and cooling control
where it is needed most. Customers can customize power and cool-
ing thresholds for either the highest level of performance or the
most efficiency; in addition, they can initiate cooling and automati-
cally control cooling levels to react to and remove heat.
As part of the Thermal Logic portfolio, HP has developed a pro-
gram called Dynamic Power Capping, which manages the power
used by hardware to maximize performance while cutting power use
as much as possible. HP says the program can increase a data cen-
ter’s capacity by as much as 300%. With that level of performance