Page 56 - Handbook of Adhesion Promoters
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3.3 Detachment                                                        49


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            efficiency.  HALS can delay the loss of adhesion strength and yellowing.  On the con-
            trary, UV absorbers and phosphites are involved in delamination and yellowing processes
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            due to their photodegradation.  The decomposition of UV absorbers leads to the forma-
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            tion of benzoic acid and a phenol products.  The acid catalyzes the adhesion loss at the
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            EVA-glass interface whereby the phenol product is the reason for the discoloration.
                The above is just one example of the polymer weathering effect on delamination, a
            broad review of the photodegradative processes can be found in the recent monographic
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            publication on the subject.
            3.3 DETACHMENT
            Adhesion of mortars to concrete and brick walls is a complex mechanism that is affected
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            by  several  factors.   The  adhesion  loss  leads  to  mortar  detachment  from  the  substrate
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            which may cause hazardous situations to passers-by.  Without mortar, the wall is directly
            exposed to the atmosphere and, therefore, its degradation processes most likely increase. 14
            Factors related to mortars’ components, renderers characteristics, substrate characteristics,
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            and mortar applications process determine adhesion of mortar to substrate.  The pull-off
            test, described in the European standard EN 1015-12 for rendering and plastering mortars,
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            measures the value of the mortar-substrate normal adhesion, when the interface fails.
            3.4 DEBONDING

            Debonding, in the context of this book, is and example of loss of adhesion between rein-
            forcement (particle or fiber) and matrix, due to the action of different stressors, such as
            hygrothermal aging, fatigue, or external stress. Below are some examples of these pro-
            cesses.
                Subcritical debonding is of particular concern for microelectronic packaging, coat-
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            ing,  and  adhesive  applications.   The  subcritical  debonding  of  epoxy/glass  interfaces
            under the hygrothermal condition is investigated in the presence of organosilane adhesion
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            promoters,  3-aminopropyltriethoxysilane  and  glycidoxypropyltrimethoxysilane.  The
            subcritical debonding growth rate mechanism was found to be sensitive to the interface
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            chemistry.  Hygrothermal aging lowers the critical debonding driving energy required for
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            debond extension.  The silane adhesion promoters decreased debonding growth rate.
                A short glass fiber reinforced polyamide (PA-66) was tested under fatigue loading. 16
            The fractographic analysis by means of the field emission scanning electron microscope
            showed that fibers are mostly covered by a resin layer, indicating that damage does not
            occur at the fiber-matrix interface in a form of fiber-matrix debonding but in the resin, at a
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            certain distance from the interface in a form of matrix cracking.  Clean fibers on the frac-
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            ture surface indicate fiber-matrix debonding.  Fibers covered by a resin layer suggest that
            damage occurs at a certain distance from the interface in a form of matrix cracking (simi-
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            lar to fatigue damage).  Sizing can affect the resin layer surrounding the fibers leading to
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            the formation of the interphase.
                In  the  silica  particle-filled  polyvinylbutyral,  the  use  of  an  adhesion  promoter
            increased the maximum local stress required to cause debonding but had no effect on the
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            interparticle stress fields.  With the volume fraction of spherical glass beads increase, the
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