Page 59 - Handbook of Adhesion Promoters
P. 59

52                                             Mechanisms of Adhesion Loss


                                                     The  automotive  coatings  are  com-
                                                 posed of several layers. The bulk photooxi-
                                                 dation  of  the  clearcoat  may  cause  the
                                                 growth of surface cracks and increase the
                                                 likelihood of peeling between clearcoat and
                                                        22
                                                 basecoat.  During weathering the percent-
                                                 age of clearcoat peeled areas increased and
                                                 the force required for peeling was dramati-
                                                            22
                                                 cally lowered.
                                                     Adhesion  between  polyimide  and
                                                 copper is an important for electronic pack-
                                                 aging  devices,  such  as  multichip  modules
                                                                              23
                                                 and  flexible  printed  circuit  boards.  The
                                                 elevated  temperature  and  high  humidity
            Figure 3.6. Peel force of pressure sensitive adhesive, 3M   environments lead to serious deterioration
            Scotch Isotac 9473, vs. peel rate. [Adapted, by permis-  of adhesion property, culminating in device
            sion, from Brockmann, W; Huether, R, Int. J. Adh. Adh.,   failure.  The cohesive failure occurs inside
                                                       23
            16, 81-6, 1996.]
                                                 the polyimide during peeling and a polyim-
                                      23
            ide trace is found on the metal.  If interfacial failure occurs, no trace of polyimide is
                               23
            found on metal surface.  The oxygen ion bombardment of the polyimide improves the
                                                23
            adhesion strength between the two materials.  The ion beam bombardment of the polyim-
                                                              23
            ide retards the loss of adhesion caused by thermal degradation.




























                                                                                   o
                                                                             o
            Figure 3.7. Images of the cohesive zone with different peeling rates and two different peeling angles 60  and 90 ,
            respectively. [Adapted, by permission, from Peng, Z; Wang, C; Chen, L; Chen, S, Int. J. Solids, Struct., 51, 4596-
            603, 2014.]
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