Page 107 - Handbook of Adhesives and Sealants
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Theories of Adhesion  75


            TABLE 2.3 Shrinkage of Common
            Adhesives 19
              Adhesive types      % Shrinkage
            Acrylics                5–10
            Anaerobics              6–9
            Epoxies                 4–5
            Urethane                3–5
            Polyamide Hot Melts     1–2
            Silicones (Curable)       1


            2.4.3  Operation in service
            Once the solidification mechanism is complete, the joint is generally
            exposed to its service environment. We refer here to the ‘‘joint’’ rather
            than the adhesive or sealant because now that the bond is created,
            the joint is a single entity that has individual characteristics of its
            own.
              The service environment may include cyclic exposure to tempera-
            ture, stress, chemicals, radiation, or a number of other environments
            that are common to the application. It is important that the joint resist
            the environmental conditions so that a practical working strength can
            be maintained throughout the expected service life. The effect of ser-
            vice conditions on the adhesive joint occurs mainly through localized
            stress or environmental aging.

            2.4.3.1  Short term effects. Localized stresses are mainly due to the
            immediate effects of temperature and differences in thermal expan-
            sion coefficient. The effect of differing thermal expansion coefficients
            on internal stress generated during cure has been discussed in the
            preceding sections. However, thermal stresses could easily occur dur-
            ing the joint’s service life.
              If the temperature is uniform throughout the bond, the approximate
            stress on a thin rigid bond may be calculated from the following re-
            lationship: 20

                                          T (k   k )
                                   S          1    2
                                        (1/E )   (1/E )
                                            1
                                                    2
            where S   shear stress on the adhesive due to differential thermal
                       expansion rates of the adherends, without consideration
                       for adhesive strain
              E , E   Young’s moduli of the adherends
                   2
                1
                  T   temperature differential between zero stress temperature
                       and service temperature (zero stress condition usually ex-
                       ists at the cure temperature)
               k , k   thermal expansion coefficients of adherends
                   2
                1
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