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238    So l i d - S t at e   La s e r s                                                                                              Thin-Disc Lasers     239


                      10.5.5  Design Study for High-Power Thin-Disc Lasers
                      For the design of high power thin-disc lasers, two mounting designs
                      seem to be promising. The “classical” design is to solder the disc onto
                      a heat sink, the alternative is to use a transparent (e.g., undoped YAG)
                      supporting structure on top of the disc and apply the cooling directly
                      to the disc. Both concepts are sketched in Fig. 10.9. In this section,
                      they will be compared based on their mechanical behavior and their
                      thermal lens. In both cases, the Yb:YAG has a thickness of 180 mm and
                      a diameter of 60 mm. It is either soldered on CuW (thickness 1.5 mm)
                      or bonded to undoped YAG for direct cooling. The pump spot radius
                      is 11 mm, and the pump power is varied between 6.4 kW and 25.6 kW.
                      Based on the quasi-static model (c.f. Sec. 10.5.8, Fig. 10.12) this would
                      be sufficient for 14 kW of laser power with one disc.
                         In Fig. 10.10, the results of FEA calculations are given. The mechan-
                      ical behavior of both designs is quite different. Because the support
                      from the heat sink is missing, the directly cooled design is less stiff and
                      it shows tensile stress in radial direction. The classical design provides
                      better compensation of the azimuthal stress. Nevertheless, the total
                      temperature rise in the directly cooled design is smaller as there is no
                      additional thermal resistance of the heat sink and the solder layer. Due
                      to these lower temperatures, also the thermally induced stress inside
                      the disc is below the critical value of 130 MPa.
                         The heat sink does not only provide stiffness to the system, it does
                      also contribute to the deformation due to the temperature gradient.



                                                                        AR coating
                                                                        Yb:YAG
                                                                        HR coating
                                                                        Solder
                                                                        CuW
                                        Cooling fluid




                                                                       AR coating
                                                                       YAG
                                                                       Yb:YAG
                                                                       HR coating
                                                                       Glue
                                                                       CuW
                                       Cooling fluid


                 Figure 10.9  Different mounting designs, top: Yb:YAG soldered on CuW (“classical”
                 thin-disc design); bottom: composite disc, directly cooled.
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