Page 203 - High Temperature Solid Oxide Fuel Cells Fundamentals, Design and Applications
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180  High Temperature Solid Oxide Fuel Cells: Fundamentals, Design and Applications


            In an effort to alleviate the Co migration problem, a number of  investigators
          have studied the (La,Ca)Crl-,03  and (La,Sr)Crl_,O3 systems [12, 17, 26-29].
          What has been found is that when powders of these compositions are prepared at
          temperatures below 'iOO"C, the powders tend to be multiphase with substantial
          quantities of either La, Ca, or Sr chromates present. These chromate phases melt
          incongruently  in the  1000-1200°C  range  and the liquid promotes sintering.
          Unfortunately. the best sinterable compositions are Cr deficient and the excess A
          site components, La, Ca, or Sr tend to segregate to the grain boundaries and
          create hydration and cracking problems under both SOFC operating and ambient
          conditions. Thus, this method of sintering has not been entirely satisfactory, but
          until a better one is discovered, it is the one being most frequently employed in
          the planar  SOFC configuration. The search is still on to develop a method  of
          densifying stoichiometric LaCrOs  which is both economical and yields stable
          interconnects.
            A number of methods are used to fabricate the interconnect. The method used
          depends on the SOFC design [30]. For the tubular design, fabrication methods
          such  as  electrochemical  vapour  deposition  (EVD),  plasma  spraying,  laser
          ablation  and slurry coating/sintering  have been used, with EVD  and plasma
          spraying being favoured. Economics is  an issue with EVD  while porosity  and
          interfacial cracking are the difficulties with plasma spraying.
            In the early  198Os, the monolithic  SOFC design made use of  tape casting,
          lamination and calendaring technology to produce a structure which was then
          sintered to  produce  a  completed SOFC  stack. On  the  surface,  this  process is
          attractive  since it offers the potential of  low cost and high power density. In
          practice,  it  is  a  very  difficult process  because  it  requires  the  simultaneous
          sintering of  all cell components. This means that the shrinkages and shrinkage
          rates must be matched for all four cell components during sintering. Also, the
          interdiffusion between the components under the high-temperature processing
          conditions must be minimised. As a result, this design has been abandoned.
            A  variation  of  the monolithic  design was  introduced by  Allied  Signal [31]
          (that first became part of  Honeywell and now a part of  General Electric Power
          Systems).  This  design  co-sinters  the  electrolyte,  cathode  and  anode,  but
          fabricates  the  interconnect  separately.  This  design  has  eliminated  the
          fabrication incompatibility  problem between  the interconnect  and  other  cell
          components, but it does have the sealing problems of  the planar cell design.
          The main  advantage of  this design is the densification of  the interconnect by
          itself so  that  it  gives  the  option  of  liquid-phase  sintering  the  interconnect
          without inducing problems with the other cell components.
            The conventional planar cell designs build the gas distribution channels into
          the interconnect in a bipolar structure. In this design, good electrical contact
          between the cell components must be maintained and the edges sealed gas-tight,
          These seals are made by  using either glasses or cements which, when heated,
          give both gas-tight seals and electrical contact. In addition to interlayer seals,
          side seals are required which are both  electrically insulating  and gas-tight. A
          number of different schemes have been tried to provide these two seals, but at the
          moment they still remain a major issue with planar SOFCs.
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