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Interconnects  181


           7.3  Metallic Interconnects
           The reduction of the cell operating temperature from 900-1000°C  down to 600-
           850°C makes the use  of  metallic materials  for the interconnect  feasible and
           attractive. The advantages of metallic interconnects over ceramic interconnects
           are obvious: lower material  and fabrication costs, easier  and more  complex
           shaping possible, better electrical and thermal conductivity and no deformation
           or  failure  due  to  different  gas  atmospheres  across  the  interconnection.  The
           interconnects can be fabricated by machining, pressing or, in the case of  powder
          metallurgical alloys, by near-net-shape sintering. The gas distribution is usually
          realised by parallel channels whilst the ridges separating the channels serve as
           electrical contact with the electrodes.
            The first reports on SOFC stacks built with metallic interconnect plates were
          published in the early  1990s [32,33]. Initial experiments with FeNiCr alloys
          showed a steady decrease in power output during single cell operation [34]. and
          later also in stack tests [35]. This deterioration was ascribed to the release of
           chromium from the alloy leading to catalytic poisoning of the cathode [36, 3 71.
          This  phenomenon  has  been  investigated  intensively,  is  now  fairly  well
          understood,  and  described later  in  this  chapter. All  early  attempts  at  using
          metallic materials as interconnect were not very successful, because the materials
           (heat-resistant steels) often contained a significant amount of  Ni leading to large
          thermal expansion mismatch between the metallic interconnect and the ceramic
          SOFC  components. The  situation  changed  with  the  use  of  chromia-forming
          materials. Various metallic interconnect materials are discussed below.


           7.3.7 Chromium-Based Alloys
           After a screening of  different chromium-based alloys, MetaIlwerke Plansee AG
          proposed  a chromium alloy containing  5 wt% iron and  1 wt% yttria  (Cr 5Fe
           IY203), theso-calledDucrolloy, for usewithelectrolyte-supported SOFCs [38]. In a
          close  collaboration  with  Siemens  AG,  this  alloy  was  used  for  assembling
           electrolyte-supported planar  cells  in  1-10  kW  size  stacks  [39,40]. The  alloy
          composition was optimised to match its thermal expansion to that of  the 8 mol%
          yttria-stabilised zirconia (8YSZ) electrolyte to successfully thermally  cycle the
          stacks. The good match  of  thermal expansion is shown in Figure 7.5. Only at
          temperatures above 800"C, the increased thermal expansion of the alloy leads to
          deviations from the thermal expansion ofYSZ and the two materials differ in TEE at
           1000"Cby  8%.
            This alloy has been investigated in detail with respect to corrosion behaviour
           [41,42] and contact resistance across its interfaces with  the electrodes [43].
          TypicaIly, Cr  5Fe 1Y203 is a chromia former and even after long-term exposure
          in oxygen or air, the chromia scales are very thin. Thicker corrosion scales grow
          in  carbon  containing  atmospheres  (methane, coal  gas) due  to  formation  of
           carbides [42].
             The fabrication  of  interconnect  plates  of  Cr  5Fe  lY203 is  done by  powder
          metallurgical methods and starts with the alloying of Cr flakes with Fe and  Y203 by
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