Page 200 - Introduction to Information Optics
P. 200

3.3. Critical Components               185
         A semiconductor laser consists of a forward-biased p-n junction. When the
       forward current through the diode exceeds a critical value known as the
       threshold current, optical gain in the resonator due to stimulated emissions
       overcomes the losses in the resonator, leading to net amplification and
       eventually to steady-state laser oscillation, as described in detail in the
       following.
         Under the forward bias, free electrons and holes will move back to the
       depleted region. Thus, there is a chance for "recombination." This recombina-
       tion process releases the energy in the "light" form -> generate light. In terms
       of band gap theory, there are two allowed energy levels existing in the material,
       which are called the conduction band and the valence band. In the conduction
       band, electrons are not bound to individual atoms so that they are free to
       move. In the valence band, unbound holes are free to move. The generated
       photon energy is determined by the band gap between the conduction and
       valence bands. Mathematically, this can be written as

                                            £,                       (3.40)

                                                  34
       where h is the Planck's constant h = 6.63 x 10 '  J • s, v is the output light
       frequency, and E c and E v are the energy of conduction and valence bands,
       respectively. Figure 3.11 shows the basic structure of a semiconductor laser.
       The polished side surfaces form the resonant cavity so that a particular
       wavelength can be amplified.
         Table 3.1 lists several types of materials used to fabricate semiconductor
       lasers and their corresponding operating wavelength range.





                                         Current /


                                           200 Mm
                           L /     300 Mm      / /-v
                            Y

                                    P
                                / M            /\ Cleaved
                                       t     100 Wn
                                                    facet
                        Saw-cut
                        facet

                      Fig. 3.11. Basic structure of the semiconductor laser.
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