Page 25 - System on Package_ Miniaturization of the Entire System

CHAPTER 1

Introduction to the

System-on-Package (SOP)

Technology

Prof. Rao R. Tummala and Tapobrata Bandyopadhyay
Georgia Institute of Technology

1.1 Introduction 4 1.7 Comparison of the Five System Technologies 23
1.2 Electronic System Trend to Digital Convergence 5 1.8 Status of SOP around the Globe 26
1.3 Building Blocks of an Electronic System 7 1.9 SOP Technology Implementations 29
1.4 System Technologies Evolution 8 1.10 SOP Technologies 33
1.5 Five Major System Technologies 11 1.11 Summary 34
1.6 System-on-Package Technology (Module with the References 34
Best of IC and System Integration) 18

he primary drivers of the information age are microsystems technologies and
market economics. Gigascale integration of microelectronics, gigabit wireless
Tdevices, terabit optoelectronics, micro- to nano-sized motors, actuators, sensors,
and medical implants and integration of all these by the system-on-package concept
leading to ultraminiaturized, multi-to-mega function are expected to be the basis of the
new information age.
This book is about system-on-package (SOP) technology in contrast to system-on-
chip (SOC) technology at the integrated circuit (IC) level and stacked ICs and packages
(SIP) at the module level. In this book, SIP is defined as the stacking of ICs and
packages. Thus SOP is considered as an inclusive system technology of which SOC,
SIP, thermal structures and batteries are considered as subset technologies. System-
on-package is a new, emerging system concept in which the device, package, and
system board are miniaturized into a single-system package with all the needed

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