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4 Cha pte r O n e

system functions. The SOP technology can be thought of as the second law of electronics
for system integration in contrast to Moore’s law for ICs.
This chapter introduces the basic concept of SOP. It reviews the characteristic features
of a system-on-package and compares it with traditional and other major system
technologies. It provides insight into the status of global research and development efforts
in this area. Finally, it outlines the different technologies involved in making SOP-based
products. The chapter concludes with an overview of all these basic SOP technologies,
which form the chapter titles of this book.

1.1 Introduction
The concept of SOP originated in the mid-1990s in the Packaging Research Center at the
Georgia Institute of Technology. The SOP is a new and emerging system technology
concept in which the device, package, and system board are miniaturized into a single-
system package with all the needed system functions. The SOP is described in this book
as the basis for the second law of electronics for system integration in contrast to Moore’s
law for IC integration. The focus of SOP is to miniaturize the entire system, such as
shown in Figure 1.1, which includes

System Components Technology Implementation
Active components SOC Production
IC packages (including stacked packages) SIP Development
IC to package and to board interconnections
Power supplies SOP Research
System boards
Passive components
Thermal structures and heat sinks
Sockets and connectors

PCB fan
mounting point
Heat sink
IC
IC package

Connectors
(I/O ports)
Discrete passives
System board
FIGURE 1.1 A typical example of a system with all its system components—DFI LanParty UT RD600.
(Courtesy: dailytech.com)