Page 28 - System on Package_ Miniaturization of the Entire System

6 Cha pte r O n e

PACKAGING BRIDE package • Nanoscale
(22 nm)
• 10% System
IC

• 90% System
Connectors
• Milli-scale
Board
Discrete

• Low functional density
• Bulky
• Costly
• Low reliability

FIGURE 1.3 Packaging is the bridge and the barrier between ICs and systems.

criteria—size of the system and functionality of the system as shown in Figure 1.2.
Computers in the 1970s were bulky, providing computing power measured in millions of
instructions per second (MIPS). The subsequent IC and package integration technologies
in the 1980s paved the way for systems with billions of instructions per second (BIPS),
which further led the way for smaller and personal systems called PCs. The technical
focus of these small computing systems by IC integration to single-chip processors, and
package integration to multilayer thin-film organic buildup technologies, together with
other miniaturization technologies such as flip-chip interconnection technology led to a
new paradigm in personal and portable systems—cell phones. This trend, as shown in
Figure 1.4, is expected to continue and to lead to highly miniaturized, multifunction-to-
megafunction portable systems with computing, communication, biomedical, and

Workstation

PC
100000 Notebook

10000 Laptop
Volume (cm 3 ) 1000 Single function Mobile Bio-sensor Functional density or component density/cm 3

Multi function
SMART
100 watch
Mega function

1960 1970 1980 1990 2000

FIGURE 1.4 Electronic system trend toward highly miniaturized digital convergence.