Page 32 - System on Package_ Miniaturization of the Entire System

10 Cha pte r O n e

Interconnects: μm → nm

Interconnects: μm → nm
Interconnects: mm → μm
100x−1000x
IC IC
miniaturization
Package Package Package IC IC
System board System package

System board
Interconnects: μm → nm
Interconnects: mm
SOB-based System SOP-based System
FIGURE 1.7 A comparison between three-tier SOB-based and two-tier SOP-based systems.

The SOP technology concept has two characteristics. First, it combines the IC, package,
and system board into a system package (as shown in Figure 1.7), hence its name system-
on-package. The second key attribute of SOP is its integration and miniaturization at the
system level just like IC integration at the device level. Unlike SIP, which enables IC stacking
without real package integration, SOP integrates all the system components either in ICs or
packages as ultrathin films or structures that include the following [4]:
• Passive components
• Interconnections

Nominal volume (%)

SIP, 3D
SOB WSI MCM SOC Si on Si SOP

1965 1975 1978 1985 1995 2015 2020

FIGURE 1.8 Historical evolution of the fi ve system technologies over the past 50 years.