Page 34 - System on Package_ Miniaturization of the Entire System

12 Cha pte r O n e

IC Integration
ASICS
DRAM
RF-IC
Storage
capacitance
OE-IC
Flash
DSP High voltage
System tunnel oxides
integration SRAM
U processor Imaging Dense features
Light sensitive devices
Source: HalLasky, IBM Microelectronics
SOC: A complete system on one chip
Package-Enabled Integration
RFIC Digital IC Optical IC

Substrate
MCM: Interconnected components
IC
Package
Flash
RAM
IC
μP
Super IC Stack (ASET) Package (Fujitsu) Stacked IC (Amkor)
SIP: Stacked chip/package for reduced form factors

SOP-Based Integration

RF IC Opto IC Digital IC
IC and RF Opto Electrical Codesign
system and
Package with opto, RF, digital functions optimization
Best of:
• IC integration
• Package-enabled integration
• System integration

FIGURE 1.9 (a) IC and package-enabled integration interconnecting two or more ICs. (b) SOP:
True package and IC integration.

that this kind of progress can go on forever, leading to a “system-on-a-chip” for all
applications to form complete end-product systems.
The SOC schematic shown in Figure 1.9a, for example, seeks to integrate numerous
system functions on one silicon device horizontally, namely the chip. If this chip can be
designed and fabricated cost effectively with computing, communication, and consumer
functions (such as processor, memory, wireless, and graphics) by integrating the required
components (such as antennas, filters, switches, transmitting waveguides, and other