Page 37 - System on Package_ Miniaturization of the Entire System
P. 37

Basic TSV Technology  2005-Hitachi 2003-IME  and Renesas  1994-Bosch  2006-Intel 2006-IBM 1999-Tru-Si  2007-IBM  2006-Samsung 2001-ASET  2001-Intel, Tessera  1993-Thomson-  CSF  1994-White  2001-Sharp Microelectronics  2001-AMKOR  2001-IMEC,  1997-Tohoku 1992-Irvine  Fujitsu  1993-nChip  2010  2000  1990  Year


                           1981-GE  1986-RPI, GE  and IBM  1983-GM


                                                                             1980


                     1971-A.D. Scarbrough  stacking  1973-IBM  1967  Bell labs  1972-IBM  1970  Emerging stacked IC and packaging technologies.










                                                         Package stacking
                                                                        Chip stacking
                                       Chip stacking
                       Si chip carrier
                            TSV
                                                               Non-TSV
                                                                                    FIGURE 1.10
                                                           SIP with wire bond, flip chip, and Cu-Cu bonding


                                                                                    15
   32   33   34   35   36   37   38   39   40   41   42