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2006-Intel 2007-IBM 2001-AMKOR 2001-IMEC, Fujitsu 2010
2005-Hitachi and Renesas 2006-IBM 2006-Samsung 2001-Intel, Tessera 2001-Sharp
2003-IME 2001-ASET 2000
1997-Tohoku
1994-White Microelectronics 1993-nChip
1999-Tru-Si
Basic TSV Technology 1994-Bosch 1993-Thomson- CSF 1992-Irvine 1990 Year
1981-GE 1986-RPI, GE and IBM 1983-GM
1980
1971-A.D. Scarbrough stacking 1973-IBM 1967 Bell labs 1972-IBM 1970 Emerging stacked IC and packaging technologies.
Chip stacking
Package stacking
Chip stacking
Si chip carrier
TSV
Non-TSV
FIGURE 1.10
SIP with wire bond, flip chip, and Cu-Cu bonding
15
