Page 288 - System on Package_ Miniaturization of the Entire System

262 Cha pte r F i v e

5.1 Introduction
RF denotes the radiofrequency spectrum, which ranges from 300 KHz to 300 GHz. The
SOP is a system miniaturization technology. RF SOP, therefore, is a miniaturization
technology, based on the SOP concept of embedded thin-film components, for wireless
systems. The SOP concept has two fundamental bases—miniaturization and optimization
of components between ICs and substrates for performance and cost. In today’s RF
communications, the volume applications are in the wireless systems and the main
drivers are cost, functionality, and size. Miniaturization of thin-film components and
their integration into RF modules are the key elements to meet these three demands.
These costs, functionalities, and size pressures are the primary drivers behind SOP, and
SOP addresses these drivers by thin-film embedded components, nanotechnology-based
batteries, thermal structures, and interconnections. The SOP concept provides a system
technology platform that enables a higher degree of miniaturization than can be achieved
by the complementary module-level SIP and SOC technologies. The fundamental basis
of SOP is about integration, which leads to higher performance and reliability, lower
cost, and reduced size just like in CMOS wafer fabrication.
This chapter describes the progress in SOP-based RF components in ceramics and
organics and on silicon wafers. The RF components include inductors, capacitors,
resistors, antennas, filters, switches, baluns, combiners, and radiofrequency identification
(RFID) implemented in both ceramic and organic technologies. The historical evolution
of RF and wireless technologies and the future trend and directions in RF SOP
technologies are discussed. Design, modeling, simulation, and component integration
challenges pertinent to the RF SOP technology are reviewed.

5.2 RF SOP Concept
There has been an emerging trend to combine computing, communicating, sensing, and
biomedical functions into one system package called SOP, as described in this book.
Figure 5.1 depicts how the SOP concept can be applied to miniaturize the RF systems

Discrete Limited component Full integration
integration

Game
Digital Audio
camera
TV Smart
Cell phone personal
Camcorder assistant
MP3

Smart
miniaturized
bio implant
GPS
Computer (courtesy: Chosun)
Cell phone today Cell phone near future Fully embedded future
FIGURE 5.1 RF miniaturization and functionality trend.