Page 347 - Sami Franssila Introduction to Microfabrication

326 Introduction to Microfabrication

Leak valve
Inert Reactive
Shutter gas gas Pressure gauge

Sputtered atom
Substrate
Plasma heater

Sputter source
Substrate
bias
−V
Substrate
holder
Cryopump for H O
2
Substrate

Vacuum
Throttle chamber

High vacuum pump

Figure 32.3 Sputtering system. Reproduced from Parsons, R., Sputter deposition processes, in J.L. Vossen & W. Kern
(eds.) (1991), by permission of Academic Press

(a) (b)
Figure 32.4 (a) PECVD TEOS oxide profile after deposition and (b) after argon sputter etching. Reproduced from
Cote, D.R. et al. (1995), by permission of IBM